Ilaphu elenziwe ngokwezifiso eliLaminated Spunlace Nonwoven
Ingcaciso yeMveliso
Ilaphu le-spunlace elalaminated libhekisa kudidi lwelaphu elingaphothiweyo elidityaniswe okanye lidityaniswe nenye imathiriyeli, ngokuqhelekileyo ngokulanyiswa. I-Lamination yinkqubo yokunamathisela umaleko wezinto ezibonakalayo kumphezulu welaphu le-spunlace ukuphucula iimpawu zayo okanye ukongeza ukusebenza okongeziweyo. Ilaphu le-spunlace lineempawu ze
Ukusetyenziswa kwelaphu leFilimu elaminethiweyo ngespunlace
Umqobo kunye nezicelo zokukhusela:
Inkqubo ye-lamination inokongeza umaleko wesithintelo kwilaphu le-spunlace, okwenza ukuba lixhathise ulwelo, iikhemikhali, okanye ezinye izinto ezingcolisayo. Oku kuyenza ilungele ukusetyenziswa kwizicelo ezifana nempahla ekhuselayo, iigawuni zotyando, okanye izixhobo zokhuselo lomntu (PPE).
Iimveliso ze-Absorbent:
Ngokulayita izinto ezifunxa kakhulu, ezinje ngomaleko wepulp, kwilaphu le-spunlace, inokuphucula amandla ayo okufunxa. Oku kuyenza ilungele ukusetyenziswa kwiimveliso ezinje ngokunxitywa kwezonyango, iipads ezifunxayo, okanye izisusi zokucoca.
Imidibaniso:
Ilaphu le-spunlace elenziwe ngelaphu lingadityaniswa nezinye izinto, njengeefilimu, amagwebu, okanye iimbrane, ukwenza izakhiwo ezidityanisiweyo ezineempawu eziphuculweyo. Ezi zixhobo zinokuba namandla aphuculweyo, ukuguquguquka, okanye iipropathi zokuthintela, zizenze zibe luncedo kwizicelo ezifana nemidiya yokucoca, ukupakishwa, okanye izinto zangaphakathi zeemoto.
I-Insulation kunye ne-cushion:
Inkqubo ye-lamination inokwazisa i-insulating okanye i-cushioning layer kwi-spunlace fabric, ukubonelela ukuchasana kwe-thermal okanye impembelelo. Oku kuyenza ilungele izicelo ezifana nezixhobo zokugquma, i-padding, okanye i-upholstery.
Izicelo eziprintwayo okanye zokuhombisa:
Ilaphu le-spunlace elaminated lingasetyenziswa njengendawo eprintwayo okanye ngeenjongo zokuhombisa. Inkqubo ye-lamination inokuququzelela ubuchule bokushicilela, njenge-inkjet okanye ukuprintwa kwesikrini, okanye ukongeza umaleko wokuhombisa ngeenjongo zobuhle.
